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Effect of Indenter Elastic Modulus on Hertzian Ring Crack Initiation in Silicon Carbide
Author(s) -
Wereszczak Andrew A.,
Daloz William L.,
Strong Kevin T.,
Jadaan Osama M.
Publication year - 2010
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/j.1744-7402.2010.02522.x
Subject(s) - materials science , composite material , stiffness , elastic modulus , cracking , silicon carbide , ring (chemistry) , modulus , organic chemistry , chemistry
Hertzian ring cracking in two SiCs was studied as a function of elastic property mismatch between indenter and target. Ring crack initiation forces (RCIF) were measured using ZrO 2 , steel, Si 3 N 4 , Al 2 O 3 , and WC balls. The SiCs were similar; however, ∼20% of the grains in one were larger than the largest grains in the other. Decreasing indenter stiffness resulted in lower RCIFs and initiation occurred at lower forces in the SiC containing larger grains. Using a spherical indenter with similar elastic properties as the target provides a simpler interpretation and useful and confident estimates of ring crack initiation stresses.