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Significance of Aluminum on Hardness of Titanium Aluminum Nitride Deposited by Magnetron Co‐Sputtering
Author(s) -
Jose Feby,
Ramaseshan Rajagopalan,
Dash Sitaram,
Rajagopalan Subbiah,
Tyagi Ashok Kumar
Publication year - 2009
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/j.1744-7402.2008.02261.x
Subject(s) - nanoindentation , materials science , sputter deposition , aluminium , indentation , amorphous solid , sputtering , nitride , metallurgy , titanium , composite material , substrate (aquarium) , titanium nitride , atomic force microscopy , cavity magnetron , physical vapor deposition , thin film , coating , crystallography , nanotechnology , layer (electronics) , chemistry , oceanography , geology
Ti 1− x Al x N films were synthesized by reactive magnetron co‐sputtering with different aluminum compositions. X‐ray diffraction, secondary ion mass spectrometry, nanoindentation, and atomic force microscopy (AFM) techniques were used to analyze these films. The as‐deposited films were crystalline for concentrations of Al (35%, 40%, 55%, and 64%) and at 81% it became amorphous. Nanoindentation hardness increases with aluminum and started to decrease beyond 81% of aluminum. Continuous multicycle indentation technique is used to analyze the failure mode of the film with highest hardness. AFM topography analysis of this film exhibited edge cracks outside and inside the indentation area and sink‐in when the penetration reaches the substrate.