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Microstructure and Creep Behavior of Silicon Nitride and SiAlONs
Author(s) -
Fox Kevin M.,
Hellmann John R.
Publication year - 2008
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/j.1744-7402.2008.02192.x
Subject(s) - creep , materials science , microstructure , grain boundary sliding , sialon , silicon nitride , composite material , diffusion creep , grain boundary , metallurgy , silicon , sintering
Microstructural evolution of silicon nitride (Si 3 N 4 ) and SiAlON materials and its influence on creep resistance is reviewed. Grain size, grain morphology, and the ratio of α‐ to β‐phase grains play a part in resistance to creep. The glassy, intergranular phase typically has the strongest influence on creep. Creep data are usually obtained using uniaxial tensile or compressive tests, where creep in tension is controlled by cavitation and grain boundary sliding controls creep in compression. The impression creep methodology is also reviewed. An additional creep mechanism, dilation of the SiAlON grain structure, was found to be active in impression creep.