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Hot Embossing: An Alternative Method to Produce Cavities in Ceramic Multilayer
Author(s) -
Rabe Torsten,
Kuchenbecker Petra,
Schulz Baerbel,
Schmidt Martin
Publication year - 2007
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/j.1744-7402.2007.02117.x
Subject(s) - materials science , lamination , embossing , ceramic , shrinkage , composite material , sintering , adhesive , enhanced data rates for gsm evolution , layer (electronics) , telecommunications , computer science
New applications of ceramic multilayers, for example, in biotechnology, sensor technology, and chemical micro‐reaction technique, call for cavities with complex geometries. Hot embossing offers a promising, cost‐effective way to generate these structures on the surfaces of green tapes or laminates. Cavities inside low‐temperature co‐fired ceramic multilayer were manufactured by a combination of hot embossing, lamination by a special adhesive technique, and zero shrinkage sintering. The edge and surface quality in the green state as well as the sintered multilayers with surface structures and cavities were extensively characterized by laser surface scanning, optical and ultrasound microscopy. Sintering shrinkage of hot‐embossed laminates could be reduced in the x and y directions to less than 0.5%.