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Multilayer Construction with Various Ceramic Films for Electronic Devices Fabricated by Aerosol Deposition
Author(s) -
Hatono Hironori,
Ito Tomokazu,
Iwata Kengo,
Akedo Jun
Publication year - 2006
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/j.1744-7402.2006.02109.x
Subject(s) - materials science , ceramic , deposition (geology) , electrode , photoresist , dielectric , fabrication , sputtering , thin film , composite material , aerosol , optoelectronics , nanotechnology , layer (electronics) , medicine , paleontology , chemistry , alternative medicine , physics , pathology , sediment , meteorology , biology
Aerosol deposition (AD) is applicable as a fabrication technology for microstructures comprising different materials. We used this method for electronic devices that consist of ceramic films and metal electrodes. Various ceramic thick films (5–50 μm thickness), for example, Al 2 O 3 , 2MgO·SiO 2 , and BaTiO 3 , were deposited on substrates using room‐temperature aerosol deposition. The dielectric constant of BaTiO 3 was 78 at 1 MHz. Multilayer constructions with ceramic films and copper electrodes were obtained using aerosol deposition and sputtering. During deposition, photoresist film masks were applied to produce patterns of ceramic films and connections between upper and lower electrodes through the ceramic films.