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In Situ Preparation of Si 3 N 4 /SiC Nanocomposites for Cutting Tools Application
Author(s) -
Šajgalík P.,
Hnatko M.,
Lenčéš Z.,
Dusza J.,
Kašiarová M.
Publication year - 2006
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/j.1744-7402.2006.02061.x
Subject(s) - materials science , nanocomposite , composite material , sintering , silicon nitride , fracture toughness , silicon carbide , indentation , weibull modulus , composite number , flexural strength , layer (electronics)
Silicon nitride–silicon carbide nanocomposite has been prepared by an in situ method that utilizes the formation of SiC nanograins by carbothermal reduction of intentionally added fine SiO 2 during the sintering process. The mean value of room‐temperature four‐point bending strength is 675 MPa with the Weibull modulus of 6.4 and an indentation fracture toughness of 7.4 MPa·m 1/2 . A significantly enhanced creep resistance was achieved by the incorporation of SiC nanoparticles into the matrix up to 1400°C. The tribological properties of the material were tested using a ball‐on‐disk configuration and showed a friction coefficient of about 0.7. The cutting inserts machined from this composite had three times longer lifetime compared with those available on the market. On the other hand, the scatter of results is much larger compared with those measured for the commercial inserts.