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Machining and Ceramic/Ceramic Joining to Form Internal Mesoscale Channels
Author(s) -
Case Eldon D.,
Ren Fei,
Kwon Patrick,
Kok Chee Kuang,
Rachedi Robert,
Klenow Bradley
Publication year - 2004
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/j.1744-7402.2004.tb00159.x
Subject(s) - materials science , ceramic , microelectronics , machining , brittleness , machinability , composite material , mechanical engineering , nanotechnology , metallurgy , engineering
Ceramics and semiconducting materials with internal channels are crucial in a variety of diverse technologies such as “lab on a chip,” fuel cell applications, and cooling of microelectronics. In this paper, techniques for fabricating internal channels in brittle materials first are reviewed. Then, the mechanical machining of surface channels in 99.99% pure alumina partially sintered at 600°C and 700°C is discussed. After machining, the partially sintered alumina is sintered to a density of about 97% of theoretical and then joined to 96% pure alumina to convert the surface channels into internal channels.