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Bond Strengths of Current Adhesive Systems on Intact and Ground Enamel
Author(s) -
SENAWONGSE PISOL,
SATTABANASUK VANTHANA,
SHIMADA YASUSHI,
OTSUKI MASAYUKI,
TAGAMI JUNJI
Publication year - 2004
Publication title -
journal of esthetic and restorative dentistry
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.919
H-Index - 60
eISSN - 1708-8240
pISSN - 1496-4155
DOI - 10.1111/j.1708-8240.2004.tb00016.x
Subject(s) - enamel paint , adhesive , current (fluid) , materials science , bond , composite material , dentistry , engineering , business , electrical engineering , medicine , layer (electronics) , finance
Purpose: The goal of this study was to compare the microshear bond strengths of current adhesive systems to intact and ground enamel surfaces. Materials and Methods: Three commercially adhesive materials were examined: a two‐step total‐etching self‐priming system (Single Bond®, 3M ESPE, St. Paul, MN, USA), a two‐step self‐etching system (Clearfil SE Bond®, Kuraray Co. Ltd., Osaka, Japan), and an all‐in‐one system (One‐Up Bond® F, Tokuyama Dental, Tokyo, Japan). The labial surfaces of extracted human incisors were used. For intact enamel surfaces, the teeth were polished with pumice. However, for the ground enamel, 0.5 mm deep, flat enamel surfaces at the midlabial aspect were ground with a no. 600 grit silicon carbide paper. Ground and intact enamel surfaces were bonded with one of three bonding systems and a resin composite and were subjected to a microshear bond test. Results: The two self‐etching systems demonstrated lower bond strengths than did the total‐etching system on intact enamel (One‐Up Bond F, 18.59 MPa; Clearfil SE Bond, 35.71 MPa; Single Bond, 47.20 MPa). No significant difference was found between the total‐etching system and the two‐step self‐etching system on ground enamel (One‐Up Bond F, 28.96 MPa; Clearfil SE Bond, 48.51 MPa; Single Bond, 51.07 MPa). Shear bond strengths on ground enamel were significantly higher than those on intact enamel except for the group that was bonded with the total‐etching system. Conclusions: The two‐step adhesives showed significantly higher bond strengths than did the one‐step adhesive. When applying the total‐etching system, no significant differences in bond strength were demonstrated between bonding to intact and to ground enamel.