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Copper‐tin phases in dental silver amalgam alloy
Author(s) -
JENSEN STIG JORGO
Publication year - 1972
Publication title -
european journal of oral sciences
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.802
H-Index - 93
eISSN - 1600-0722
pISSN - 0909-8836
DOI - 10.1111/j.1600-0722.1972.tb00276.x
Subject(s) - tin , amalgam (chemistry) , copper , alloy , ternary operation , materials science , phase diagram , metallurgy , ternary alloy , phase (matter) , chemistry , electrode , organic chemistry , computer science , programming language
– The ternary equilibrium silver‐copper‐tin diagram has been investigated in the region 25–30 weight‐% Sn, 0–4 weight‐% Cu using an X‐ray diffraction technique. Phase fields containing Cu 3 Sn (ɛ) and Cu 6 Sn 5 (η′) were indicated. In addition, the phases formed during non‐equilibrium treatment have been determined.