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Y 4 Si 2 O 7 N 2 : A New Oxynitride with Low Thermal Conductivity
Author(s) -
Sun Luchao,
Liu Bin,
Wang Jiemin,
Wang Jingyang,
Zhou Yanchun,
Hu Zijun
Publication year - 2012
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1551-2916.2012.05389.x
Subject(s) - thermal conductivity , thermal stability , materials science , thermal , ceramic , analytical chemistry (journal) , chemistry , mineralogy , thermodynamics , physics , composite material , chromatography , organic chemistry
Search for new thermal barrier materials with high‐temperature stability is very difficult because there are intractable choices among thousands of possible candidates. The present paper shows that identifying and developing new low thermal conductivity materials can be accomplished by first‐principles calculations of equilibrium crystal structure and elasticity, and thereafter making theoretical prediction of minimum high‐temperature lattice thermal conductivity basing on David Clarke's method for insulating materials. We highlight a new oxynitride ceramic, Y 4 Si 2 O 7 N 2 , with a low theoretical minimum thermal conductivity of 1.12 W·m −1 ·K −1 . The theoretical result is further validated by experimental measurement of thermal conductivity of dense and bulk Y 4 Si 2 O 7 N 2 . The experimental thermal conductivity is 1.50 W·m −1 ·K −1 at 1300 K. Furthermore, thermal properties of Y 4 Si 2 O 7 N 2 are investigated for evaluating its potential performances.