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Boron Nitride‐Based Overcoat Thick Films for MoSi 2 Planar Heating Elements
Author(s) -
Kim Byeong Kon,
Lee Hyung Sub,
Jeong Cheol Weon,
Han Dong Bin,
Jeon Min Seok,
Song Jun Kwang,
Cho Yong Soo
Publication year - 2009
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1551-2916.2009.03113.x
Subject(s) - materials science , boron nitride , softening point , dielectric , composite material , thermal conductivity , boron , nitride , substrate (aquarium) , planar , layer (electronics) , optoelectronics , chemistry , oceanography , computer graphics (images) , organic chemistry , computer science , geology
This work first reports a boron nitride‐based dielectric system that is designed for MoSi 2 –based planar heating elements patterned on a regular 96% alumina substrate. The dielectric system is expected to function as an overcoat layer mainly to protect the printed heating elements from environments and to reduce thermal stress induced during thermal heating through improved heat dissipation. The boron nitride (BN) pastes mixed with a low softening glass of calcium barium aluminoborosilicate were screen printed onto MoSi 2 thick films and then fired at a temperature of 900°C. The addition of BN was found to increase the thermal conductivity considerably without detrimental chemical reactions with glass constituents. For instance, the thick film containing 30 wt% BN was regarded as a promising composition from the supporting evidences of good adhesion with MoSi 2 , an increased thermal conductivity of ∼31 W·(m·K) −1 , and a high electrical resistance of 4.7 × 10 10 Ω.