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Thermal Shock Resistance of an AlN–BN–SiC Ceramic
Author(s) -
Buchheit Andrew A.,
Hilmas Greg E.,
Fahrenholtz William G.,
Deason Douglas M.
Publication year - 2009
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1551-2916.2009.03050.x
Subject(s) - materials science , thermal shock , ceramic , quenching (fluorescence) , thermal conductivity , composite material , atmospheric temperature range , thermal , thermodynamics , physics , quantum mechanics , fluorescence
Mechanical and thermal properties of AlN–BN–SiC (ABS) ceramics were used to calculate the R, R ′, and R ″″ thermal shock parameters. The R parameter values ranged from ∼400° to 450°C. Specimens were thermal shocked by water quenching and the critical quench temperatures (Δ T C ) were compared with those of a baseline SiC composition. The behavior of the ABS was predicted by R parameter calculations while the behavior of the baseline material was predicted by the R ′ calculations due to its higher thermal conductivity (87 W·(m·K) ‐1 ) as compared with the ABS materials (∼30 W·(m·K) −1 ). The highest critical quench temperature for ABS was ∼415°C with the lowest at 360°C, while the critical quench temperature for the baseline material was 450°C. Using temperature dependent data over an appropriate temperature range (room temperature to the predicted Δ T C ), the R parameters of the ABS materials were within 15°C of predictions. The baseline material was ∼1.7 times higher than predicted and this was attributed to the high‐thermal conductivity of the material resulting in soft thermal shock during quench testing.