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High‐Thermal‐Conductivity AlN Filler for Polymer/Ceramics Composites
Author(s) -
Kume Shoichi,
Yamada Ikuko,
Watari Koji,
Harada Isao,
Mitsuishi Kenshi
Publication year - 2009
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1551-2916.2008.02650.x
Subject(s) - materials science , ceramic , composite material , thermal conductivity , boron nitride , composite number , conductivity , filler (materials) , polymer , nitride , polyimide , chemistry , layer (electronics)
To increase the thermal conductivity of polymer/ceramic composites, aluminum nitride (AlN) granules were added as a ceramic filler. Granules, sintered at 1850°C for 24 h, showed a very high conductivity of 266±26 W (m·°C) −1 , as measured by a thermal microscope equipped with thermoreflectant and periodic heating techniques. This conductivity exceeds 80% of the theoretical value of AlN. Ceramic fillers consisting of the obtained AlN granules and commercially available hexagonal boron nitride particles (h‐BN) powder plus polyimide resins were mixed and then molded at 100 MPa and 420°C in a vacuum. The resultant composite showed a high conductivity of 9.3 W (m·°C) −1 . This study demonstrates that a high‐thermal‐conductivity filler effectively enhances the conductivity of polymer/ceramic composites.