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Contact Damage of Silicon Carbide/Boron Nitride Nanocomposites
Author(s) -
Kusunose Takafumi,
Sekino Tohru,
Niihara Koichi
Publication year - 2007
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1551-2916.2007.01894.x
Subject(s) - materials science , microstructure , nanocomposite , silicon carbide , composite material , boron carbide , boron nitride , silicon nitride , hot pressing , deformation (meteorology) , layer (electronics)
To investigate the deformation mechanism of silicon carbide (SiC)/boron nitride (BN) nanocomposites, Hertzian contact tests were performed on monolithic SiC, and nanocomposite and microcomposite SiC/BN. Monolithic SiC had the typical microstructure of hot‐pressed SiC with Y 2 O 3 and Al 2 O 3 additives, composed of slightly large grains in small matrix grains. The microcomposite comprised large BN grains dispersed along the grain boundaries of elongated SiC grains, while the nanocomposite showed a finer microstructure with fine BN particles and small matrix grains. These microstructural differences led to differences in the mechanism of contact damage. The damage of the monolithic SiC and the SiC/BN microcomposite exhibited classical Hertzian cone fracture and many large cracks, whereas the damage observed in the nanocomposites appeared to be quasi‐plastic deformation.