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Structural Analysis on Planar Defects Formed in WC Platelets in Ti‐Doped WC–Co
Author(s) -
Lay Sabine,
Loubradou Marc,
Schubert Wolfdieter
Publication year - 2006
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1551-2916.2006.01218.x
Subject(s) - materials science , microstructure , sintering , basal plane , doping , planar , stacking , platelet , phase (matter) , grain boundary , composite material , crystallography , electron microscope , grain size , metallurgy , optics , chemistry , optoelectronics , computer graphics (images) , organic chemistry , computer science , immunology , biology , physics
Platelet‐reinforced WC–Co alloys are processed by liquid‐phase sintering from very fine‐grained WC powders in the presence of small amounts of TiC. Large and flat WC grains develop in the material. The microstructure of these platelets is investigated by high‐resolution electron microscopy in order to obtain information on their formation mechanism. Inside the grains, an extended defect parallel to the basal plane is observed. It can be described by a pair of stacking faults with a shear vector equal to 1/3 〈0‐110〉 occurring in two successive (0001) planes. At the level of the faults, the plane spacing is slightly reduced. The defect area is similar to a thin cubic layer about 0.5 nm thick at the interior of the platelet. The enhanced grain growth of the platelets is likely related to the presence of the defect area.