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Interfacial Peeling Moments and Shear Forces at Free Edges of Multilayers Subjected to Thermal Stresses
Author(s) -
Hsueh C. H.,
Luttrell C. R.,
Lee S.,
Wu T. C.,
Lin H. Y.
Publication year - 2006
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1551-2916.2006.00924.x
Subject(s) - materials science , shear (geology) , shear stress , composite material , shear force , enhanced data rates for gsm evolution , thermal , stress (linguistics) , moment (physics) , finite element method , mechanics , classical mechanics , physics , thermodynamics , telecommunications , linguistics , philosophy , computer science
Stresses normal to interfaces, i.e., interfacial peeling stresses and interfacial shear stresses, exist locally at edges of multilayers because of both the thermal mismatch between layers and the free‐edge effect. These peeling and shear stresses can result in modes I and II edge delamination, respectively. However, because of the complexity of the problem, exact closed‐form solutions for these stresses are very difficult if not impossible to derive even for bilayered systems. Hence, instead of the detailed stress field at edges, both the interfacial peeling moment resulting from the localized peeling stresses and the interfacial shear force resulting from the localized shear stresses are analyzed here. Exact closed‐form solutions for the peeling moment and the shear force at each interface in elastic multilayered systems are derived. To illustrate the application of present closed‐form solutions, specific results are calculated for five‐layered thermal barrier coating systems, and a finite‐element analysis is also performed to confirm the analytical results.