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Fractography, Mechanical Properties, and Microstructure of Commercial Silicon Nitride–Titanium Nitride Composites
Author(s) -
Blugan Gurdial,
Hadad Mousab,
JanczakRusch Jolanta,
Kuebler Jakob,
Graule Thomas
Publication year - 2005
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1551-2916.2005.00186.x
Subject(s) - tin , materials science , fracture toughness , composite material , titanium nitride , fractography , microstructure , nitride , thermal expansion , toughness , silicon nitride , metallurgy , layer (electronics)
Commercial‐grade Si 3 N 4 –TiN composites with 0, 10, 20, and 30 wt% TiN content have been characterized. Submicrometer grain‐size Si 3 N 4 was reinforced with fine TiN grains. Density, Young's modulus, coefficient of thermal expansion, and fracture toughness increased linearly with TiN content. Increased strength was observed in the Si 3 N 4 +20 wt% TiN, and Si 3 N 4 +30 wt% TiN composites. Fractography was used to characterize the different types of fracture origins. Improvements in toughness and strength are due to residual stresses in the Si 3 N 4 matrix and the TiN particles. A threefold improvement in dry wear resistance of the Si 3 N 4 +30 wt% TiN composite over the Si 3 N 4 matrix was observed.