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Fabrication of Elongated α‐SiAlON via a Reaction‐Bonding Process
Author(s) -
Kaga Youichirou,
Jones Mark I.,
Hirao Kiyoshi,
Kanzaki Shuzo
Publication year - 2004
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1551-2916.2004.00956.x
Subject(s) - sialon , sintering , materials science , fabrication , ceramic , nitriding , fracture toughness , shrinkage , composite material , phase (matter) , metallurgy , mineralogy , layer (electronics) , chemistry , medicine , alternative medicine , organic chemistry , pathology
A reaction‐bonding process, which offers low sintering shrinkage and is a low‐cost process, was applied to fabricate Y–α‐SiAlON ceramics. The green compacts composed of Si, Y 2 O 3 , Al 2 O 3 , and AlN were nitrided and subsequently postsintered. Dense single‐phase Y–α‐SiAlON with elongated grain morphology could be achieved in the specimen postsintered at 1900°C. The material exhibited high hardness (1850 HV10) and high fracture toughness (5.1 MPa·m 1/2 ).