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Influence of Microstructure Evolution on the Electroconducting Behavior of Intragranular TiN/ZTM Nanocomposites
Author(s) -
Jin Xihai,
Gao Lian,
Li Jingguo,
Zheng Shan
Publication year - 2004
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1551-2916.2004.00162.x
Subject(s) - microstructure , materials science , mullite , sintering , tin , nanocomposite , electrical resistivity and conductivity , composite material , cubic zirconia , hot pressing , metallurgy , ceramic , electrical engineering , engineering
Electroconductive zirconia‐toughened mullite (TiN/ZTM) intragranular nanocomposite was fabricated by hot‐pressing a powder mixture of nano‐sized TiN, ZrO 2 (2Y), and mullite gel. The material showed a good sinterability and could be highly densified at a low temperature of 1300°3C. Sintering temperature strongly influenced the microstructure and electrical resistivity of the material. The electrical resistivity increased monotonously from 20 Ω‐cm to 1.5 times 10 6 °3Cm, as the sintering temperature was increased from 1300° to 1500°3C. TEM results indicated that such a phenomenon could be ascribed to the changes in the microstructure of the material, which led to a decrease in the connectivity of the TiN network in the sample as the sintering temperature was increased.