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Stability of Microstructure of Ultrafine‐Grained Copper Under Fatigue and Thermal Exposition
Author(s) -
Kunz L.,
Lukáš P.,
Pantělejev L.,
Man O.
Publication year - 2011
Publication title -
strain
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.477
H-Index - 47
eISSN - 1475-1305
pISSN - 0039-2103
DOI - 10.1111/j.1475-1305.2009.00710.x
Subject(s) - microstructure , materials science , annealing (glass) , transmission electron microscopy , ultimate tensile strength , thermal stability , composite material , copper , metallurgy , grain size , nanotechnology , chemistry , organic chemistry
Effect of cyclic loading and thermal exposition on microstructure of bulk ultrafine‐grained Cu prepared by equal channel angular pressing was experimentally investigated by means of electron backscattering diffraction and by transmission electron microscopy. Stability of the microstructure under stress‐controlled cyclic loading with a tensile mean stress of 200 MPa was shown to be high. Neither dynamic grain coarsening nor development of bimodal microstructure was observed. However, annealing at 250 °C for 30 min resulted in formation of bimodal microstructure. Consequently, fatigue strength of annealed specimens was low.