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Vapour Pressure Modelling for Plastic Encapsulated Microelectronics Subjected to Lead‐Free Solder Reflow Profile
Author(s) -
Wang Z.
Publication year - 2011
Publication title -
strain
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.477
H-Index - 47
eISSN - 1475-1305
pISSN - 0039-2103
DOI - 10.1111/j.1475-1305.2008.00597.x
Subject(s) - microelectronics , reliability (semiconductor) , soldering , materials science , lead (geology) , mechanical engineering , finite element method , composite material , structural engineering , engineering , nanotechnology , power (physics) , physics , geomorphology , geology , quantum mechanics
A universal, practical vapour pressure modelling scheme for the plastic encapsulated microelectronics (PEMs) subjected to lead‐free solder reflow profile and other high temperature conditions is presented. The proposed technique employs finite‐element moisture diffusion and structural analysis to calculate the dynamic vapour pressure buildups at the interfacial delaminations in the PEMs. The modelling scheme uses a non‐iterative approach, and it is capable of accurately and efficiently determining the dynamic vapour pressure information required for the reliability‐related design and failure analysis of various kinds of PEMs. The modelling scheme has considerable value to the development of new materials, innovative structures, and effective protection methods for enhancing the performance and reliability of plastic packages.