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Investigation of Analytical Solutions for Bonded Structures by Photomechanical Methods
Author(s) -
Wang W.C.,
Hsu J.S.
Publication year - 2006
Publication title -
strain
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.477
H-Index - 47
eISSN - 1475-1305
pISSN - 0039-2103
DOI - 10.1111/j.1475-1305.2006.00262.x
Subject(s) - photoelasticity , displacement (psychology) , finite element method , moment (physics) , transverse plane , structural engineering , interferometry , thermal , materials science , stress (linguistics) , optics , physics , engineering , composite material , classical mechanics , solid mechanics , thermodynamics , psychology , linguistics , philosophy , psychotherapist
In this paper, both photoelasticity and moiré interferometry were successively incorporated with finite element method to investigate the predicted thermal stresses and lateral displacement of bonded structures calculated from different theories. It was found that the distributions of moment and transverse force play significant roles in making different values of thermal stresses in the adherends by authors’ and Suhir's 1986 theories. On the other hand, the values of lateral displacement obtained from different theories are almost identical.