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Determination of Residual Stresses by Thermal Relaxation and Speckle Correlation Interferometry
Author(s) -
Pechersky M. J.
Publication year - 2002
Publication title -
strain
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.477
H-Index - 47
eISSN - 1475-1305
pISSN - 0039-2103
DOI - 10.1111/j.1475-1305.2002.00030.x
Subject(s) - speckle pattern , residual stress , interferometry , speckle imaging , residual , electronic speckle pattern interferometry , materials science , relaxation (psychology) , optics , laser , spectral density , thermal , stress relaxation , composite material , physics , engineering , mathematics , thermodynamics , psychology , social psychology , telecommunications , creep , algorithm
A new technique for the measurement of residual stresses is presented. The technique is based on strain measurements following thermal stress relaxation. The heat input is supplied by a low power infrared laser and the strain is measured with speckle pattern correlation interferometry. This paper presents a comprehensive overview of the technique and an example of how it has been applied in a practical situation.
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