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A probabilistic approach for thermal shock fatigue life of glass
Author(s) -
OGI K.,
ITO K.
Publication year - 2011
Publication title -
fatigue and fracture of engineering materials and structures
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.887
H-Index - 84
eISSN - 1460-2695
pISSN - 8756-758X
DOI - 10.1111/j.1460-2695.2011.01556.x
Subject(s) - thermal shock , biot number , weibull distribution , materials science , thermal fatigue , borosilicate glass , shock (circulatory) , flexural strength , finite element method , weibull modulus , structural engineering , composite material , thermal , thermodynamics , mathematics , engineering , physics , statistics , medicine
This paper presents a probabilistic approach for predicting fatigue life of glass subjected to near‐ Δ T C (critical temperature difference) thermal shock which exhibits little subcritical crack extension. First, thermal shock fatigue life N f was derived as a function of temperature difference Δ T , fracture probability F and Biot's modulus β from the slow crack growth concept in conjunction with the Weibull distribution model. Next, thermal shock fatigue tests as well as flexural tests were performed for borosilicate glass to measure Δ T C and N f versus Δ T . The parameters associated with slow crack growth were then determined from the experimental results while the heat transfer coefficient h or β was obtained with the aid of finite element analysis. Thirdly, the thermal shock fatigue diagram (Δ T − N f curves) was depicted for various values of β. Finally, crack length was simulated on the basis of the present approach.