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Tensile testing of silicon thin films
Author(s) -
TSUCHIYA T.
Publication year - 2005
Publication title -
fatigue and fracture of engineering materials and structures
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.887
H-Index - 84
eISSN - 1460-2695
pISSN - 8756-758X
DOI - 10.1111/j.1460-2695.2005.00910.x
Subject(s) - materials science , ultimate tensile strength , microscale chemistry , cantilever , silicon , tensile testing , composite material , fabrication , thin film , optoelectronics , nanotechnology , medicine , mathematics education , mathematics , alternative medicine , pathology
The tensile strength of silicon thin films was investigated using a specimen chucking system dedicated for microscale specimens. The system uses electrostatic force to fix and hold the free end of the cantilever‐shaped specimens. The thin film tensile tester was built using this system. The accuracy and reliability of this method were assured by comparing it with other tensile‐testing methods using single‐crystal silicon specimens. The result shows good agreement between the testing methods. The strength properties of polysilicon thin films, such as the effect of the testing environment and the specimen size and the film fabrication conditions, were investigated.