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A THREE‐DIMENSIONAL FINITE ELEMENT ANALYSIS FOR A CRYSTALLOGRAPHIC CRACK NEAR THE INTERFACE OF AN INCOMPATIBLE BICRYSTAL
Author(s) -
Li Chingshen
Publication year - 1993
Publication title -
fatigue and fracture of engineering materials and structures
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.887
H-Index - 84
eISSN - 1460-2695
pISSN - 8756-758X
DOI - 10.1111/j.1460-2695.1993.tb00068.x
Subject(s) - materials science , finite element method , crack tip opening displacement , tilt (camera) , fracture (geology) , shielding effect , crack closure , interface (matter) , deformation (meteorology) , composite material , shear (geology) , stress (linguistics) , anisotropy , constraint (computer aided design) , structural engineering , fracture mechanics , geometry , electromagnetic shielding , mathematics , physics , optics , engineering , linguistics , philosophy , capillary number , capillary action
On the basis of modelling bicrystal deformation, using three‐dimensional, anisotropic finite elements, the problem of a crystallographic crack approaching the interface in a [111] tilt bicrystals of 90˚ misfit angle under shear loads is solved. The influence of thickness direction material heterogeneity across the interface on the distribution of the stresses, strains and crack sliding displacements along the crack front near the interface has been revealed. As the crack approaches the interface, those mechanical parameters are considerably changed by the heterogeneity across the interface. Remarkable variations in the stresses and strains along the crack front have also been identified and are referred to the different constraint across the thickness. The maximum stress may shift from the crack tip to the interface ahead of it, where, as suggested by numerical results and previous experimental observation, a new fracture process core may be activated. The interface‐induced crack shielding or antishielding under mode II and III loading is analyzed and discussed.