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Possible factors in the adhesion of fissure sealants to enamel
Author(s) -
WILLIAMS B.,
FRAUNHOFER J. A.
Publication year - 1979
Publication title -
journal of oral rehabilitation
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.991
H-Index - 93
eISSN - 1365-2842
pISSN - 0305-182X
DOI - 10.1111/j.1365-2842.1979.tb00415.x
Subject(s) - enamel paint , bond strength , ultimate tensile strength , acid etching , aqueous solution , composite material , adhesion , materials science , etching (microfabrication) , fissure , chloride , chemistry , adhesive , metallurgy , organic chemistry , layer (electronics)
Summary The type of aqueous solution used to wash the enamel surface immediately after etching with orthophosphoric acid affected the tensile bond strength obtained. Washing with a 1% potassium chloride solution was found to effect an improved bond strength, but no difference was observed when different types of water were employed for this purpose. A similar finding of no difference in bond strength was obtained when the possible influence of electrostatic forces was eliminated.