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Microstructure of electrodeposited NiFe/Cu multilayers
Author(s) -
TOKARZ A.,
WIECZOREK P.,
LIS A.K.,
MORGIEL J.
Publication year - 2010
Publication title -
journal of microscopy
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.569
H-Index - 111
eISSN - 1365-2818
pISSN - 0022-2720
DOI - 10.1111/j.1365-2818.2009.03293.x
Subject(s) - crystallite , bilayer , materials science , microstructure , transmission electron microscopy , diffraction , thin film , deposition (geology) , scanning electron microscope , crystallography , nanostructure , analytical chemistry (journal) , composite material , optics , nanotechnology , metallurgy , chemistry , paleontology , biochemistry , physics , chromatography , membrane , sediment , biology
Summary NiFe/Cu multilayer films have been electrodeposited potentiostatically on (001)‐oriented Si and polycrystalline Cu substrates by a single bath technique. Standard error of mean and energy dispersive X‐ray studies of single NiFe(Cu) layers allow us to establish the right deposition parameters for NiFe and Cu sublayer. Standard error of mean results reveal the layered structure of deposits for relatively thick bilayer thickness (ca. ∼200 nm). The modulated structure of NiFe/Cu multilayers with extremely thin bilayer thickness (nominal period Λ= 8 nm) was investigated by transmission electron microscope techniques. A columnar structure of the deposit with column diameter in the range from 10 to 30 nm was observed. These results are comparable with X‐ray diffraction measurements of crystallites size obtained by Scherer equation. The line scans acquired using EDS confirmed the layered structure of the deposit, but pointed towards possibility of intermixing of species from alternating sublayers especially in case of those with finer period.