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Variable‐depth electropolishing of TEM samples
Author(s) -
LEONARD S. W.
Publication year - 1993
Publication title -
journal of microscopy
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.569
H-Index - 111
eISSN - 1365-2818
pISSN - 0022-2720
DOI - 10.1111/j.1365-2818.1993.tb03397.x
Subject(s) - electropolishing , polishing , materials science , transmission electron microscopy , sample (material) , dislocation , scanning electron microscope , optics , ion milling machine , metallurgy , composite material , layer (electronics) , chemistry , nanotechnology , physics , electrode , chromatography , electrolyte
Summary A variable‐depth electropolishing technique has been developed for transmission electron microscopy samples using copper as sample material. This was required for an experiment concerning the measurement of the variation of dislocation density with depth for ion‐implanted materials. The polishing technique was achieved by a two‐step process, involving the measurement and use of the polishing rate to polish to a specific depth and the application of a transparent cover to one side of the sample for back‐thinning. With this technique, any sample depth can be made accessible for observation with a transmission electron microscope and the method should be applicable to many different materials and electropolishers.