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Failure analysis of plastic encapsulated components—the advantages of IR microscopy *
Author(s) -
Brown J.,
Footner P. K.,
Richards B. P.
Publication year - 1987
Publication title -
journal of microscopy
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.569
H-Index - 111
eISSN - 1365-2818
pISSN - 0022-2720
DOI - 10.1111/j.1365-2818.1987.tb02865.x
Subject(s) - materials science , computer science , microscopy , reliability engineering , nanotechnology , forensic engineering , engineering , medicine , pathology
SUMMARY This paper demonstrates that the use of an IR microscope in non‐destructive failure analysis of plastic encapsulated devices overcomes many of the problems previously associated with conventional failure analysis techniques. Moreover, the devices are amenable to subsequent examination and testing. Its advantages are highlighted in a number of case histories, concerning bond quality, corrosion and features of poor processing. The consequential modification to failure analysis methodology and its applicability to VLSI devices are discussed.