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Microscopy Of Voiding During Creep Of Alpha‐Brass
Author(s) -
Elliott I. C.,
Wilshire B.
Publication year - 1979
Publication title -
journal of microscopy
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.569
H-Index - 111
eISSN - 1365-2818
pISSN - 0022-2720
DOI - 10.1111/j.1365-2818.1979.tb00187.x
Subject(s) - creep , brass , void (composites) , materials science , intergranular corrosion , grain boundary , metallurgy , composite material , corrosion , crystallography , microstructure , chemistry , copper
SUMMARY Metallographic and fractographic methods have been used to study void formation during high‐temperature creep of alpha‐brass. The appearances of the creep fracture surfaces were found to differ markedly at high and low stress levels. Cavity development was therefore monitored using samples tested to various fractions of their creep lives which were then fractured in an intergranular manner by stress‐corrosion at room temperature. The different modes of void formation observed can be rationalized in terms of a model for cavity growth based on the movement of lattice dislocations in the plane of the grain boundary.