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A high voltage electron microscope study of recrystallization in copper alloys
Author(s) -
Ray R. K.,
Hutchinson W. B.,
Besag F. M. C.,
Smallman R. E.
Publication year - 1973
Publication title -
journal of microscopy
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.569
H-Index - 111
eISSN - 1365-2818
pISSN - 0022-2720
DOI - 10.1111/j.1365-2818.1973.tb03776.x
Subject(s) - recrystallization (geology) , nucleation , copper , materials science , electron microscope , metallurgy , crystallography , dynamic recrystallization , hot working , microstructure , chemistry , optics , paleontology , physics , biology , organic chemistry
SUMMARY Recrystallization and recovery have been studied in the high voltage electron microscope (HVEM) in pure copper and two copper‐phosphorus alloys following heavy rolling deformation. Prior to the nucleation of recrystallized grains, extensive subgrain growth occurs by sub‐boundary migration. In the alloys, the first recrystallized grains are observed to nucleate within deformed matrix regions of the same orientation. The orientations of these grains are in close agreement with the crystallographic texture of the metal at complete recrystallization. Growth selection of orientation does not appear to be important. In pure copper, cube‐oriented recrystallized grains form after those of some other orientations, but grow more rapidly and absorb these during growth.