z-logo
Premium
Effect of baking procedure and storage on the pasting properties and staling of part‐baked and rebaked wheat bran bread
Author(s) -
Karaoğlu Mehmet Murat
Publication year - 2006
Publication title -
international journal of food science and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.831
H-Index - 96
eISSN - 1365-2621
pISSN - 0950-5423
DOI - 10.1111/j.1365-2621.2006.01407.x
Subject(s) - food science , bran , chemistry , volume (thermodynamics) , water activity , yield (engineering) , propionate , viscosity , materials science , water content , raw material , composite material , biochemistry , physics , geotechnical engineering , organic chemistry , quantum mechanics , engineering
Summary Wheat bran breads were part‐baked for 10, 15, 20 min at 230°C, with and without calcium propionate (0.2%), stored at refrigerator temperature (4°C) for 7, 14, 21 days and wrapped with two polyethylene bags. After storage, part‐baked and rebaked breads were subjected to volume, water activity and softness analysis, and pasting properties of bread crumb were determined using the Brabender amylograph. Addition of calcium propionate decreased pasting temperature and water activity of crumb of bran bread, while the bump area and viscosity values increased. The increase of initial baking time resulted in a decrease of pasting temperature, water activity and softness value, and in an increase of the bump area, viscosity and volume yield of the rebaked bran bread crumb. Pasting temperature, volume yield, water activity and softness value of crumb of the rebaked bran bread decreased with longer (intermediate storage) time. Pasting temperature, bump area and water activity significantly correlated with softness of bread crumb. The rebaking process of bran bread, which was part‐baked for 10 min and stored for 7 and 14 days at refrigerator temperature, resulted in a softer crumb than in the control group.

This content is not available in your region!

Continue researching here.

Having issues? You can contact us here