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Effect of Packaging Materials on Temperature Fluctuations in Frozen Foods: Mathematical Model and Experimental Studies
Author(s) -
ZURITZ CARLOS A.,
SASTRY SUDHIR K.
Publication year - 1986
Publication title -
journal of food science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.772
H-Index - 150
eISSN - 1750-3841
pISSN - 0022-1147
DOI - 10.1111/j.1365-2621.1986.tb11229.x
Subject(s) - cardboard , thermal conduction , heat transfer , materials science , slab , mechanics , thermal , corrugated fiberboard , air layer , thermodynamics , layer (electronics) , composite material , geology , physics , geophysics
An analytical solution of the conduction heat transfer equation was developed for prediction of temperature in frozen foods exposed to periodic environmental temperature fluctuations. The prediction model includes the effect of surface heat transfer resistances. Theoretical predictions were compared with experimental values recorded from frozen ice cream at different storage regimes. Slab‐shaped metal containers were used in the experiment. Surface heat transfer resistances were simulated with single layers of commercial packaging cardboard sheets and restricted air movement over the containers. A satisfactory agreement was obtained between predicted values and experimental data. Packaging materials coupled with a layer of stagnant air are effective barriers against thermal fluctuations.