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The “Itrinsic” Thermal Conductivity of Wet Soy Protein and Its Use in Predicting the Effective Thermal Conductivity of Soybean Curd
Author(s) -
YANO TOSHIMASA,
KONG JAYYUL,
MIYAWAKI OSATO,
NAKAMURA KOZO
Publication year - 1981
Publication title -
journal of food science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.772
H-Index - 150
eISSN - 1750-3841
pISSN - 0022-1147
DOI - 10.1111/j.1365-2621.1981.tb04174.x
Subject(s) - soy protein , thermal conductivity , thermal conduction , chemistry , conductivity , thermal , materials science , food science , composite material , thermodynamics , physics
The applicability of four heat conduction models to heterogeneous materials was examined for defatted soy protein curd with various water contents. Only the series model was applicable to both frozen and unfrozen soy protein curds. The “intrinsic” thermal conductivity of wet soy protein was determined on the basis of the series model to be 0.300 W/m·K for unfrozen curd and 0.488 W/m·K for frozen curd. By using the series model and the “intrinsic” thermal conductivity values of soy protein, the effective thermal conductivity of fat‐containing soybean curd, unfrozen or frozen, was predicted satisfactorily. The “intrinsic” thermal conductivity values of wet soy protein were independent of temperature in the ranges from 0° to 20°C and from −5° to −20°C.