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Effect of Sintering Additive Composition on the Processing and Thermal Conductivity of Sintered Reaction‐Bonded Si 3 N 4
Author(s) -
Zhu Xinwen,
Zhou You,
Hirao Kiyoshi
Publication year - 2004
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2004.tb07747.x
Subject(s) - sintering , materials science , thermal conductivity , silicon nitride , composition (language) , nitride , phase (matter) , silicon , conductivity , thermal , chemical engineering , composite material , mineralogy , metallurgy , chemistry , thermodynamics , linguistics , philosophy , physics , organic chemistry , layer (electronics) , engineering
Two compositions of the Y 2 O 3 –MgO (YM) and Yb 2 O 3 –MgO (YbM) systems were chosen to study the effect of the sintering additive composition on the processing and thermal conductivity of sintered reaction‐bonded silicon nitride (SRBSN). The nitridation, postdensification, microstructural evolution, and thermal conductivity of SRBSN were found to depend strongly on the sintering additive composition. The RBSN materials with YbM exhibited a poor sinterability, whereas those with YM exhibited an excellent sinterability. However, the SRBSN materials with YbM showed a higher thermal conductivity than those with YM. This was associated primarily with the isolated distribution and lower amount of secondary phase and the higher percentage of large grains in the former materials.