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Determination of the Thermal Resistance of the Polymer–Ceramic Interface of Alumina‐Filled Polymer Composites
Author(s) -
Hill Richard F.,
Supancic Peter H.
Publication year - 2004
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2004.tb06326.x
Subject(s) - materials science , composite material , ceramic , interfacial thermal resistance , polymer , thermal conductivity , thermal resistance , wafer , sapphire , thermal , nanotechnology , laser , physics , optics , meteorology
To model the thermal conductivity of polymer composites that are filled with ceramic powders, the conductivity of each component as well as the interfacial resistance at each ceramic–polymer boundary must be known. An indirect method to determine this interfacial boundary resistance is proposed by preparing large‐scale “macromodel” simulations of the polymer–ceramic interface. Macromodels, prepared by spin‐coating a polymer layer onto sapphire wafers, were formed in a sapphire–polymer–sapphire sandwich type structure. The interfacial boundary thermal resistance was calculated from thermal resistance measurements made on the macromodels.