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Strength of Silicon Nitride after Thermal Shock
Author(s) -
She Jihong,
Yang JianFeng,
Jayaseelan Daniel Doni,
Ueno Shunkichi,
Kondo Naoki,
Ohji Tatsuki,
Kanzaki Shuzo
Publication year - 2003
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2003.tb03527.x
Subject(s) - thermal shock , materials science , silicon nitride , quenching (fluorescence) , composite material , ceramic , ultimate tensile strength , compressive strength , shock (circulatory) , thermal , nitride , silicon , flexural strength , metallurgy , medicine , physics , layer (electronics) , quantum mechanics , meteorology , fluorescence
A water‐quenching technique was used to evaluate the thermal‐shock strength behavior of silicon nitride (Si 3 N 4 ) ceramics in an air atmosphere. When the tensile surface was shielded from air during the heating and soaking process, the quenched specimens showed a gradual decrease in strength at temperatures above 600°C. However, the specimens with the air‐exposed surface exhibited a ∼16% and ∼29% increase in strength after quenching from 800° and 1000°C, respectively. This is because of the occurrence of surface oxidation, which may cause the healing of surface cracks and the generation of surface compressive stresses. As a result, some preoxidation of Si 3 N 4 components before exposure to a thermal‐shock environment is recommended in practical applications.