Premium
Effect of Bonding Pressure on Silicon Nitride Joining Using a Nickel‐Chromium‐Boron Metal Filler
Author(s) -
Liang Yanan N.,
Osendi Maria Isabel,
Miranzo Pilar
Publication year - 2003
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2003.tb03456.x
Subject(s) - materials science , nickel , chromium , layer (electronics) , silicon nitride , silicon , metal , boron , boron nitride , composite material , nitride , metallurgy , chemistry , organic chemistry
Mechanical pressure exerts a noticeable effect on the reaction that takes place at the interfacial region of Si 3 N 4 /Ni‐Cr‐B/Si 3 N 4 joints. In fact, the mechanical pressure affects the thickness of the reaction layer: for lower pressures, a large interfacial reaction layer and a profusion of cracks are observed, whereas, for higher pressures, the extent of the reaction layer is limited, and no cracks are detected. The results show that joint strength increases monotonically with applied pressure.