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Electrodeposition Method for Terminals of Multilayer Ceramic Capacitors
Author(s) -
Trinh Hung,
Talbot Jan B.
Publication year - 2003
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2003.tb03395.x
Subject(s) - electrolytic capacitor , capacitor , ceramic capacitor , materials science , plating (geology) , film capacitor , ceramic , electrolyte , nickel , copper , metallurgy , copper plating , polymer capacitor , composite material , electroplating , voltage , electrode , electrical engineering , chemistry , engineering , layer (electronics) , geophysics , geology
A method using a combination of electroless and electrolytic plating was developed to provide an alternative method for forming the end terminals of multilayer ceramic capacitors. Electrodeposited terminals were formed by using electroless copper followed by electrolytic nickel plating. The electrical characteristics of the electrodeposited terminal capacitors were compared with standard capacitors and found to be identical.