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Ultrasonic Velocity Technique for Nondestructive Quantification of Elastic Moduli Degradation during Creep in Silicon Nitride
Author(s) -
Lofaj František,
Blessing Gerald V.,
Wiederhorn Sheldon M.
Publication year - 2003
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2003.tb03381.x
Subject(s) - creep , materials science , silicon nitride , cavitation , ultrasonic sensor , composite material , ceramic , ultimate tensile strength , acoustics , physics , layer (electronics)
The ultrasonic velocity technique was used for nondestructive quantification of creep damage during interrupted tensile creep tests at 1400°C in an advanced silicon nitride to investigate the possibilities of this technique for creep damage monitoring in ceramic components. The longitudinal and shear wave velocities, Poisson's ratio, and Young's, shear, and bulk moduli linearly decreased with strain. Precise density change measurements indicated a linear relationship with a coefficient of proportionality of 0.69 between the volume fraction of cavities and tensile strain. Cavitation was identified as the main creep mechanism in the studied silicon nitride and the reason for ultrasonic velocity and elastic moduli degradation. The measurement of just the longitudinal wave velocity changes was found to be sufficient for quantification of cavitation during creep. The capability of the ultrasonic velocity technique for simple, sensitive, and reliable nondestructive monitoring of creep damage during intermittent creep was demonstrated in silicon nitride.