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Thermal Shock Behavior of Silicon Oxycarbide Foams
Author(s) -
Colombo Paolo,
Hellmann John R.,
Shelleman David L.
Publication year - 2002
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2002.tb00452.x
Subject(s) - materials science , thermal shock , composite material , ceramic , quenching (fluorescence) , flexural strength , porosity , stiffness , silicon , residual strength , temperature cycling , elastic modulus , thermal , metallurgy , physics , quantum mechanics , meteorology , fluorescence
Silicon oxycarbide (SiOC) ceramic foams, obtained from the pyrolysis of a preceramic polymer, were subjected to thermal multiple cycles from 800°–1200°C to room temperature in a water bath. Flexural and compression strengths, as well as elastic modulus, were characterized before and after quenching. Excellent thermal shock and cycling resistance behavior was observed, with only moderate strength and stiffness degradation. The phase assemblage of the foam remained unchanged, and no crack formation in the foams was observed. However, microstructural characterization revealed the development of porosity in the struts and cell walls due to the oxidation of residual carbon in the amorphous SiOC material, thereby contributing to a small decrease in stiffness after quenching.