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Effects of an Electroplated Platinum Interlayer on the Morphology and Phases of Chemically‐Vapor‐Deposited Alumina on Single‐Crystal, Nickel‐Based Superalloy
Author(s) -
Su YiFeng,
Torzilli Michele A.,
Meyer Justin Daniel,
Rawn Claudia J.,
Lance Michael J.,
Ruppi Sakari,
Lee Woo Y.
Publication year - 2002
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2002.tb00409.x
Subject(s) - materials science , electroplating , superalloy , chemical vapor deposition , layer (electronics) , platinum , coating , nickel , chemical engineering , alloy , metallurgy , single crystal , amorphous solid , substrate (aquarium) , crystal (programming language) , composite material , nanotechnology , crystallography , catalysis , chemistry , biochemistry , oceanography , programming language , geology , computer science , engineering
The feasibility of preparing a thin layer of α‐Al 2 O 3 on the surface of a single‐crystal, Ni‐based superalloy was examined using a chloride‐based chemical vapor deposition (CVD) process previously developed for cutting tool applications. A coating directly deposited by this method on the alloy surface consisted of ∼1 μm α‐Al 2 O 3 crystals in a matrix of amorphous Al 2 O 3 . When the alloy surface was predeposited with an electroplated Pt layer, the coating was mostly α‐Al 2 O 3 , but with the presence of fine microcracks on the coating surface. In comparison to the results observed for pure Pt substrate, the role of the Pt interlayer was apparently to promote the rapid formation of κ‐Al 2 O 3 nuclei, which subsequently transformed to α‐Al 2 O 3 during the CVD growth process.