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Thermal Shock Resistance of Silicon Nitrides Using an Indentation–Quench Test
Author(s) -
Lee Seung Kun,
Moretti James D.,
Readey Michael J.,
Lawn Brian R.
Publication year - 2002
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2002.tb00083.x
Subject(s) - thermal shock , materials science , indentation , silicon nitride , microstructure , quenching (fluorescence) , composite material , fracture toughness , nitride , shock (circulatory) , vickers hardness test , silicon , indentation hardness , metallurgy , optics , medicine , physics , layer (electronics) , fluorescence
Thermal shock resistance of silicon nitrides is investigated using an indentation–quench method. Four commercially available silicon nitrides with different microstructures are investigated. The extension of Vickers radial cracks is measured as a function of quenching temperature for each material, up to the critical temperature for failure. An indentation fracture mechanics analysis is used to account for the crack responses, with due allowance for R ‐curve behavior. The analysis confirms the important role of microstructure in thermal shock resistance.