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Cyclic Fatigue‐Crack Growth and Fracture Properties in Ti 3 SiC 2 Ceramics at Elevated Temperatures
Author(s) -
Chen Da,
Shirato Kiroshi,
Barsoum Michel W.,
ElRaghy Tamer,
Ritchie Robert O.
Publication year - 2001
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2001.tb01115.x
Subject(s) - materials science , microstructure , composite material , fracture toughness , ceramic , brittleness , crack growth resistance curve , toughness , fracture mechanics , crack closure
The cyclic fatigue and fracture toughness behavior of reactive hot‐pressed Ti 3 SiC 2 ceramics was examined at temperatures from ambient to 1200°C with the objective of characterizing the high‐temperature mechanisms controlling crack growth. Comparisons were made of two monolithic Ti 3 SiC 2 materials with fine‐ (3–10 μm) and coarse‐grained (70–300 μm) microstructures. Results indicate that fracture toughness values, derived from rising resistance‐curve behavior, were significantly higher in the coarser‐grained microstructure at both low and high temperatures; comparative behavior was seen under cyclic fatigue loading. In each microstructure, Δ K th fatigue thresholds were found to be essentially unchanged between 25° and 1100°C; however, there was a sharp decrease in Δ K th at 1200°C (above the plastic‐to‐brittle transition temperature), where significant high‐temperature deformation and damage are first apparent. The substantially higher cyclic‐crack growth resistance of the coarse‐grained Ti 3 SiC 2 microstructure was associated with extensive crack bridging behind the crack tip and a consequent tortuous crack path. The crack‐tip shielding was found to result from both the bridging of entire grains and from deformation kinking and bridging of microlamellae within grains, the latter forming by delamination along the basal planes.