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Lead Zirconate Titanate Thin Films on Base‐Metal Foils: An Approach for Embedded High‐Permittivity Passive Components
Author(s) -
Maria JonPaul,
Cheek Kevin,
Streiffer Stephen,
Kim SeungHyun,
Dunn Greg,
Kingon Angus
Publication year - 2001
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2001.tb01029.x
Subject(s) - materials science , lead zirconate titanate , permittivity , thin film , dielectric , capacitance , composite material , capacitor , dissipation factor , titanate , electrode , nickel , ferroelectricity , optoelectronics , metallurgy , nanotechnology , electrical engineering , ceramic , voltage , chemistry , engineering
An approach for embedding high‐permittivity dielectric thin films into glass epoxy laminate packages has been developed. Lead lanthanum zirconate titanate (Pb 0.85 La 0.15 (Zr 0.52 Ti 0.48 ) 0.96 O 3 , PLZT) thin films were prepared using chemical solution deposition on nickel‐coated copper foils that were 50 μm thick. Sputter‐deposited nickel top electrodes completed the all‐base‐metal capacitor stack. After high‐temperature nitrogen‐gas crystallization anneals, the PLZT composition showed no signs of reduction, whereas the base‐metal foils remained flexible. The capacitance density was 300–400 nF/cm 2 , and the loss tangent was 0.01–0.02 over a frequency range of 1–1000 kHz. These properties represent a potential improvement of 2–3 orders of magnitude over currently available embedded capacitor technologies for polymeric packages.