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High‐Temperature Fracture Energy of Superplastically Forged Silicon Nitride
Author(s) -
Kondo Naoki,
Inagaki Yoshiaki,
Suzuki Yoshikazu,
Ohji Tatsuki
Publication year - 2001
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2001.tb00916.x
Subject(s) - materials science , silicon nitride , superplasticity , fracture (geology) , grain boundary , flexural strength , nitride , silicon , bending , composite material , displacement (psychology) , metallurgy , microstructure , layer (electronics) , psychology , psychotherapist
The fracture energy of superplastically forged silicon nitride, where rodlike silicon nitride grains are aligned in one direction, was investigated at high temperatures from 1100° to 1300°C and at room temperature. Bending tests using chevron‐notched beams were conducted at two displacement rates, 0.05 and 0.005 mm/min. The superplastically forged silicon nitride showed remarkably high fracture energies, 200–630 J/m 2 . The fracture energy was largely dependent on the temperature and the displacement rate. The high fracture energy was attributed to grain pullout enhanced by the softened grain‐boundary glassy phase and the aligned rodlike grains.