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Grain‐Size Effect on Compressive Creep of Silicon‐Carbide‐Whisker‐Reinforced Aluminum Oxide
Author(s) -
ArellanoLópez Antonio R.,
MeléndezMartínez Juan J.,
DomínguezRodríguez Arturo,
Routbort Jules L.,
Lin HuaTay,
Becher Paul F.
Publication year - 2001
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2001.tb00892.x
Subject(s) - whisker , creep , materials science , grain boundary sliding , whiskers , composite material , grain size , grain boundary , silicon carbide , carbide , deformation (meteorology) , deformation mechanism , stress (linguistics) , diffusion creep , metallurgy , microstructure , linguistics , philosophy
The steady‐state compressive creep of Al 2 O 3 with 10 vol% SiC whiskers having grain sizes of 1.2, 2.3, and 4.0 μm has been measured at 1400°C in argon. The creep rate is related to the free volume within the whisker network, not the nominal grain size. The results are consistent with diffusional‐controlled creep with different contributions from grain‐boundary sliding. Under low stresses, only Liftshitz sliding is possible and the diffusional process controls deformation, while at stresses over a threshold, Rachinger sliding is the mechanism controlling deformation. The evolution between Liftshitz and Rachinger sliding is marked by a significant increase in the value of the stress exponent.