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Influence of the Compositional Profile of Functionally Graded Material on the Crack Path under Thermal Shock
Author(s) -
Fujimoto Takao,
Noda Naotake
Publication year - 2001
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2001.tb00864.x
Subject(s) - thermoelastic damping , thermal shock , materials science , stress intensity factor , ceramic , composite material , cracking , thermal , transient (computer programming) , finite element method , plane stress , shock (circulatory) , functionally graded material , material properties , structural engineering , fracture mechanics , engineering , medicine , physics , meteorology , computer science , operating system
Thermal cracking under a transient‐temperature field in a ceramic/metal functionally graded plate is discussed. When the functionally graded plate is cooled from high‐temperature, curved or straight crack paths often occur on the ceramic surface. It is shown that the crack paths are influenced by the compositional profile of the functionally graded plate. Transient‐thermal stresses are treated as a linear quasi‐static thermoelastic problem for a plane strain state. The crack paths are obtained using finite element method with Mode I and Mode II stress intensity factors.