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Seamless Joining of Silicon Nitride Ceramics
Author(s) -
Gopal Mani,
Sixta Mark,
Jonghe Lutgard,
Thomas Gareth
Publication year - 2001
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.2001.tb00730.x
Subject(s) - silicon nitride , materials science , sintering , fabrication , ceramic , nitride , joint (building) , composite material , silicon , flexural strength , metallurgy , structural engineering , medicine , alternative medicine , pathology , layer (electronics) , engineering
High‐strength joining of Si 3 N 4 ceramics has been achieved by developing a process that effectively eliminates the seam, and may allow for fabrication of large or complex silicon nitride bodies. This approach to joining is based on the concept that when sintering aids are effective in bonding individual grains, they could be equally effective in joining bulk pieces of Si 3 N 4 . Optimization of the process led to Si 3 N 4 /Si 3 N 4 joints with room‐temperature bend strengths as high as 950 MPa, corresponding to more than 90% of the bulk strength of the Si 3 N 4 . At elevated temperatures of 1000° and 1200°C joint strengths of 666 and 330 MPa, respectively, were obtained, which are the highest values reported to date for these temperatures. These bend strengths are also more that 90% of the strength of bulk Si 3 N 4 measured at these temperatures.